Appeared at 2024 the 5th Shenzhen International New Materials Exhibition
On June 26-28, 2024, 2024 the 5th Shenzhen International New Materials Exhibition and Summit Forum opened at the shenzhen world exhibition & convention center. Pioneer New Material Technology Co.,Ltd participated in the theme exhibition of the 5th Shenzhen Adhesive Sealants and Dispensing Equipment Exhibition as scheduled. The exhibition was organized by Shenzhen Liyue Exhibition Co., Ltd. and Bohan Exhibition (Shenzhen) Co., Ltd., and co organized by Guangdong Adhesive Industry Association, Shenzhen Plastic Association, and Shenzhen Graphene Association. Pioneer New Material exhibited at booth 7F67.
On the first day of the exhibition on June 26th, a series of products exhibited at the BPioneer New Material booth were particularly eye-catching. As a high-quality raw material supplier for molybdenum disulfide in the lubrication field, Pioneer New Materials can provide plastic modification additives including high purity molybdenum disulfide, fluorinated graphite,boron nitride , as well as solid organic molybdenum and Nano silica. Molybdenum disulfide, cubic boron nitride, fluorinated graphite and Nano silica are widely used as solid lubrication materials in organic silicone sealants, organic silicone rubber, Coatings and other fields,improving the dispersion stability, wear resistance and microseismic wear performance of the materials. Have in-depth and detailed face-to-face exchanges with industry experts, industry insiders, and technical experts from upstream and downstream industries, there was a surge of people at the Pioneer New Material Exhibition!
At the exhibition site, the 2024 Shenzhen International Coatings, Inks, and Adhesives Exhibition, as well as the 12th CIME2024 Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition and the 2024 International Thermal Conductive and Cooling Development Summit Forum, were held simultaneously, with a total exhibition area of 30000 square meters. During the exhibition, leading companies in the adhesive and semiconductor industries from around the world gathered on site to discuss and showcase the latest products and technological solutions.
The attending representatives also attended the International Forum on the Development of Thermal Conductivity and Heat Dissipation, listening to industry experts sharing their opinions on the diversification and combination of thermal conductive and heat dissipation materials, as well as timely updates on the hottest thermal management materials, designs, and other solutions. The exhibition concluded perfectly on June 28th!
